Silicone Thermal Grease Paste HY510 10g

Thermal Compound Paste (10g) – CPU / Heatsink

High-performance thermal compound designed to improve heat transfer between CPUs and heatsinks. This paste helps efficiently disperse heat, reducing operating temperatures in electronic components.

Included

1 × 10g thermal compound paste

Specifications

• Material: Silver-bearing silicone
• Colour: Grey
• Thermal conductivity: >1.93 W/m·K
• Thermal resistance: <0.225 °C·in²/W
• Weight: 10g
• Condition: Brand new

Features

• Suitable for CPU and heatsink applications
• High thermal conductivity for efficient heat dissipation
• High temperature resistance
• Non-toxic and non-corrosive
• Low bleed formulation

Notes

• Clean CPU and heatsink surfaces before application
• Apply a thin, even layer (recommended thickness: 0.13–0.15mm)
• Avoid removing heatsink after installation once applied
• Aftermarket thermal compound and not brand-specific